Redovne i akcijske cene

Kretanje cene u prethodnom periodu
Specifikacija i karakteristike
Opšte karakteristike
Dizajn i materijali
Oprema, elementi i sastavni delovi
Vrsta i karakteristike
Model
Tehničke karakteristike
Performanse i tehničke informacije
SPD Latency: JEDEC standard DDR4-2666 timing of 19-19-19 at 1.2V.
On-Die Termination (ODT): Nominal and dynamic for data, strobe, and mask signals.
MRS: Mode Register Set enables Fixed burst chop (BC) of 4 and burst length (BL) of 8.
16 Internal Banks: Organized into 4 groups of 4 banks each.
FBGA Components: Sixteen 2G x 8-bit per module
DIMM with gold contact fingers
OTF: On-the-fly selection of BC4 or BL8
Fly-By Topology
Terminated Control: Command and address bus
PCB Height: 1.18” (30.00mm)
RoHS Compliant and Halogen-Free
LPASR: Low-power auto self refresh
DBI: Data bus inversion for data bus
On-Die VREFDQ: Generation and calibration
Dual-Rank
SPD EEPROM: On-board I2 serial presence-detect
Row Cycle Time (tRCmin): 45.75ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin): 350ns(min.)
Row Active Time (tRASmin): 32ns (min.)
UL Rating: 94 V - 0
Storage Temperature: -55°C to +100°C