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Aluminum heat spreader with unique and specific design element.
It surpasses extreme overclocked DDR4 modules, doubling the bandwidth of DDR4.
The modules have onboard power management ICs for efficiency and lower power consumption.
Onboard thermal management technology extends module lifespan.
Enables blazing quick application start-ups and expands system capabilities.
The ultimate solution for gaming enthusiasts globally.
Dimensions: 137 x 43 x 7 mm
Feature Overclock: XMP 3.0 overclocking supported
Thermal sensor
Certifications: CE/FCC/RoHS/BSMI/UKCA
Weight: 52 g
Base Timings: 40-40-40-76
Base Voltage: 1.1V
Tested Timings: 36-36-36-68
Tested Voltage for XMP Profile 1: 1.25V
Tested Timings: 36-36-36-68
Tested Voltage for XMP Profile 2: 1.2V
Tested Timings: 36-36-36-68
Tested Voltage for EXPO Profile 1: 1.25V
Tested Timings: 36-36-36-68
Tested Voltage for EXPO Profile 2: 1.2V